AMOS 5000

  • The AMOS-5000 modular chassis kit is designed to take advantage of boards based on the developed Em-ITX form factor, making it easy to create a range of highly versatile, fanless, rugged and easy to assemble IPC design for a range of embedded applications.
  • The AMOS-5000 chassis kit takes advantage of the unique features that Em-ITX brings to the embedded market, including a rich I/O feature set along both sides of the board through unique dual I/O coastlines, an EMIO bus which uses both legacy and modern bus technologies to work with a range of Em-ITX expansion modules in a variety of application specific I/O configurations.
  • Systems built using the AMOS-5000 chassis kit are completely fanless and withstand a wide temperature range of -20°c to 55°c. Capable of sustaining a g-force of up to 50, AMOS-5000 chassis are easily assembled and maintained, using only five mechanical pieces to form a robust, fanless system with extensive I/O options.
  • The AMOS-5000 is currently paired with the EITX-3000 board, the first Em-ITX board on the market, targeting a wide variety of embedded segments including medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.

Key Features:

  • Fanless operation from -20°C up to 55°C
  • Easy, quick installation and maintenance with only five parts
  • Shock resistant up to 50G with vibration resistant design to ensure extended reliability
  • Modularized design with compact dimensions: 232mm(W) x 53mm(H) x 126mm(D)
  • Easy to use inter-changeable and customizable front and rear panels
  • Built-in common I/O functional feature cutouts for easy external access
  • Maximum space efficiency for optimized electromagnetic compatibility 


  • The MIC-3082A 12U general purpose, multi-segment, packet switched Compact PCI enclosure is an extremely flexible, high-availability platform, configurable for both compute intensive and I/O-intensive applications.
  • It is one of several telecom building blocks from Intel®, built on the PICMG 2.16 specification, providing OEM equipment designers with carrier-grade, standards-based solutions.
  • This high-capacity Compact PCI platform features innovative power and cooling.
  • The MIC-3082A platform is highly modular, scalable, and extremely serviceable.
  • It is designed to operate with Advantech’s high-performance CPU boards and packet switched backplane products, and with third-party boards meeting PICMG 2.16 specifications

Flexible Backplane Configurations
The backplane is flexible and can accommodate multiple configurations.

  • Blade servers -Supports up to 18 independent servers communicating over the PICMG 2.16-compliant Ethernet backplane (slots 2-19) with dual switch blades.
  • Single system -One PCI segment with total 18 slots available for your application with optional switch capability.
  • Dual system -Two independent PCI segments which allow two independent systems.
  • Quad system -Four independent PCI segments which allow multiple independent systems.

The MIC-3082A has a 64-bit PCI-to-PCI bridge module to extend the number of I/O slots. All slots support IEEE 1101.11, with 80mm-deep transition cards in the rear-panel I/O section, directly behind the backplane. Each node and fabric slot may be independently configured for 3.3 V or 5 V I/O operations.